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In recent years, cutting-edge packaging technology development is fierce. In addition to securing ability, cost reduction is required.
Packaging technology has evolved from a wafer level package(WLP) to a panel level package(PLP) which is further increased in area to reduce cost. Preventing warp deformation is an important technical issue because of the large area of any substrates.
I’d like to provide you the analysis software(VESAP) which can be solve the warp deformation and viscoelastic stress. I’m sure that the VESAP is useful for helping you to get optimization of materials, structure and manufacturing process design for preventing warpage, crack and delamination of multi-laminated substrates constructed with various materials for electronics substrates, such as WLP and PLP, etc.